schottky die 70 x 92 mils sc070.....5. series www.irf.com 1 bulletin i0509j rev. a 05/01 not to scale note: 10 mils die thickness is available on specific request only. contact factory for information. 40 (157) ? 125 (492) notes: 1. all dimensions are shown in millimeters (mils). 2. controlling dimension: (mils). 3. dimensions and tolerances: a = 1.78 + 0, - 0.01 (70 + 0, - 0.4) b = 2.34 + 0, - 0.01 (92 + 0, - 0.4) c = 1.63 + 0, - 0.01 (64 + 0, - 0.4) d = 2.18 + 0, - 0.01 (86 + 0, - 0.4) ? = 0.7 0.1 (30 4) 4. letter designation: a = anode (top metal) c = cathode (back metal) d = reject ink dot (only on non-conforming dies) 5. sawing: recommended blade semitec s1025 qs00 blade sawing street 0.05 + 0, - 0.005 (2 + 0, - 0.2) a d ? 0.35 0.01 c a d c b (14 0.4) wafer flat alligned with side b of the die
sc070.....5. 2 bulletin i0509j rev.a 05/01 www.irf.com sc070xxxxx5 b inked probed unsawn wafer (wafer in box) 2500 sc070xxxxx5 r probed die in tape & reel n.a sc070xxxxx5 p probed die in waffle pack 2500 sc070xxxxx5 f inked probed sawn wafer on film 2500 electrical characteristics device metal thickness metal thickness # front metal back metal sc070xxxx a 5x wire bondable -- al 30 k? -- cr 1 k? ni 2 k? ag 3 k? sc070xxxx s 5x solderable ti 2 k? ni 1 k? ag 35 k? cr 1 k? ni 2 k? ag 3 k? mechanical data device description minimum order quantity # die in sale package packaging recommended storage environment: store in original container, in dessicated nitrogen, with no contamination. shelf life for parts stored in above condition is 2 years. if the storage is done in normal atmosphere shelf life is reduced to six months. device t j max. v r typ. i r @ 25c typ. i r @ 125c max. v f @ i f package # (c) (v) (a) (ma) (v) style sc070 r 015x5x 125 15 n.a. contact factory sc070 s 020x5x 150 20 n.a. contact factory sc070 s 030x5x 150 30 90 38 0.55 @ 12a dpak (to-252) sc070 s 045x5x 150 45 70 32 0.70 @ 15a to-220 sc070 s 060x5x 150 60 n.a. contact factory sc070 h 045x5x 175 45 12 4 0.56 @ 15a to-220 sc070 h 100x5x 175 100 5 2.5 0.95 @ 12a dpak (to-252) sc070 h 150x5x 175 150 2 1.5 1.1 @ 10a to-220
sc070.....5. 3 bulletin i0509j rev. a 05/01 www.irf.com sc 070 s 045 a 5 b 1 2 3 1 - schottky die 2 - chip dimension in mils 3 - process (see electrical characteristics table) 4 - voltage code: code = v rrm 5 - chip surface metallization (see mechanical data table) 6 - wafer diameter in inches 7 - packaging (see packaging table) 4 device code ordering information table 56 7 h = 830 process r = or'ing process s = standard process wafer on film
sc070.....5. 4 bulletin i0509j rev.a 05/01 www.irf.com wafer in box die in waffle pack round container foam disk tyvek disk chip tray pocket
sc070.....5. 5 bulletin i0509j rev. a 05/01 www.irf.com world headquarters: 233 kansas st., el segundo, california 90245 u.s.a. tel: (310) 322 3331. fax: (310) 322 3332. european headquarters: hurst green, oxted, surrey rh8 9bb, u.k. tel: ++ 44 1883 732020. fax: ++ 44 1883 733408. ir canada: 15 lincoln court, brampton, markham, ontario l6t3z2. tel: (905) 453 2200. fax: (905) 475 8801. ir germany: saalburgstrasse 157, 61350 bad homburg. tel: ++ 49 6172 96590. fax: ++ 49 6172 965933. ir italy: via liguria 49, 10071 borgaro, torino. tel: ++ 39 11 4510111. fax: ++ 39 11 4510220. ir far east: k&h bldg., 2f, 30-4 nishi-ikebukuro 3-chome, toshima-ku, tokyo, japan 171. tel: 81 3 3983 0086. ir southeast asia: 1 kim seng promenade, great world city west tower,13-11, singapore 237994. tel: ++ 65 838 4630. ir taiwan: 16 fl. suite d.207, sec. 2, tun haw south road, taipei, 10673, taiwan. tel: 886 2 2377 9936. http://www.irf.com fax-on-demand: +44 1883 733420 data and specifications subject to change without noti ce.
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